Heat Up Quickly, The hot air rework have PID technology ensures a rapid temperature rise control. the hot air gun heats up to 500degC in 10-25 seconds and keeps its temperature. Ideal for De-soldering SOIC, CHIP, QFP, PLCC, BGA and repairing mobile phones, repairing laptops, repairing circuit boards etc. Adopted PID program to monitor the temperature of the hot air gun, it can ensure the stability of temperature. Temperature Range 100 to 480. High Quality Desoldering Gun. The soft air design is suitable for blowing heat sensitive parts, and the surrounding plastic parts are not deformed. Automatic cooling function for effectively prolonging the heater's life and protecting the hot air heater.8 adjustable air volume levels (max. 120 l m) and 3 additional nozzles (8 10 13*13mm) conduct a concentrated heat flow to the work surface. Air Flow Max. 120L min Component Length of Handle ?120cm Display Digital LED When the temperature is less than 70 degree, can stop rotation automatically.